منابع مشابه
Modeling and Optimization of Wire EDM Process
The present work is aimed to optimize the parameters of (WEDM) process by considering the effect of input parameters viz. Time On, Time Off, Wire Speed & Wire Feed. Experiments have been conducted with these parameters in three different levels data related to process responses viz. Metal removal rate, surface roughness (Ra) have been measured for each of the experimental run. These data have b...
متن کاملComputer simulation of wire-EDM taper-cutting
Wire electro discharge machining (WEDM) has become one of the most popular processes for producing precise geometries in hard materials, such as those used in the tooling industry. Since it is recognized as a precision process, optimization of different aspects related to dimensional accuracy is a classic research topic. The so-called tapercutting involves the generation of inclined ruled surfa...
متن کاملWire Edm Machining Simulations Based on Step-nc Program
Preliminary notes This paper presents the possibilities of applying a new method of programming based on STEP-NC standards, which was developed as an alternative to the G code. The possibilities of application in the field of machining simulation and verification of the program before machining on the wire electrical discharge machine are discussed. The paper shows the possible methodology for ...
متن کاملDevelopment of Multi-wire Edm Slicing Method for Silicon Ingot
INSTRUCTIONS The diameter of silicon wafer becomes larger in order to increase the number of chips per one wafer. For such a larger diameter silicon ingot is mainly sliced by using multi-wire method, in which a long thin wire is used with slurry. In this method, several hundreds of wafers could be sliced at the same time. However there are still problems remained, such as large cracks, slurry t...
متن کاملSmart-Wire: Enhanced Communication Hardware
The progress in the design and development of small-scale computing devices to this date has established the possibility to integrate these computing devices into virtually all everyday objects. For the near future we expect the availability of even smaller and more densely integrated devices providing us with even more resources and computing power. Existing applications will benefit from this...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Procedia CIRP
سال: 2018
ISSN: 2212-8271
DOI: 10.1016/j.procir.2017.12.032